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Smart Terminal
Rigid Materials
RF Materials
Automotive Materials
Flexible Materials
IC Substrate Materials
IMS and HTC materials
Special Materials
HSD Materials
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 不流动P片
- 其它
- 超低介质损耗
- 低介质损耗
- 叠层母排用绝缘胶膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 热固性树脂体系
- 硬质聚酰亚胺材料
- 半挠性材料
- 特种粘合材料
- 中等介质损耗
- 铝基板
- 铜基板
- 挠性覆铜板
- 覆盖膜
- 胶膜
- 补强板
- 常规FR-4.0
- 无铅兼容FR-4.0, FR-15.0
- 无卤无铅兼容FR-4.1, FR-15.1
- IC Substrate
- 涂树脂铜箔
- 碳氢系列产品
- 导热FR-4.0
- 汽车产品
- 智能终端产品
- 常规刚性产品
- 汽车产品
- 射频与微波材料
- 金属基板与高导热产品
- IC封装产品
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- 台湾
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- 研发及工程化对外业务
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- 知识产权和标准对外业务
- 人才培养和技术培训
- CQC Certificate
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- UL File (UL IQ link)
- Education
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- 资教助学
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- 广东意昂体育
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- 江苏意昂体育
- 江西意昂体育
- 香港意昂体育
- 台湾意昂体育
- 台湾
- PTFE Type
- 热固性树脂体系
- 硬质聚酰亚胺材料
- 半挠性材料
- 特种粘合材料
- 中等介质损耗
- 低介质损耗
- 超低介质损耗
- 挠性覆铜板
- 覆盖膜
- 不流动P片
- 胶膜
- 补强板
- 叠层母排用绝缘胶膜
- 东莞
- 苏州
- 咸阳
- 韩国
- 欧洲
- 美国中北大道
- 美国森林大道
- 日本
- 东莞万江
- 咸阳
- 苏州
- 常熟
- 南通
- 九江
- 东南亚
- 巴西
- 常规FR-4.0
- 无铅兼容FR-4.0, FR-15.0
- 无卤无铅兼容FR-4.1, FR-15.1
- CEM-1
- CEM-3, CEM-3.1
- IC Substrate
- 涂树脂铜箔
- 碳氢系列产品
- 铝基板
- 铜基板
- 导热FR-4.0
- 其它
- UL档案
- UL认证（查询）
- CQC认证
- BSI认证
- JET认证
- VDE认证
- 三会规则
- 工作制度
- 内部控制
- 研发及工程化对外业务
- 委托测试对外业务
- 知识产权和标准对外业务
- 人才培养和技术培训
- 联系方式
- 汽车产品
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
Input specification value filtering
Product List
- product name
- Product brief description
- CTI
- Thermal conductivity（W/m·K）
- Df/10GHz
- Dk/10GHz
- application area
- Dk
- Df
- CTE
- Tg
- Td
- SLF
- Low Df adhesiveless SS flexible copper clad laminate
- --
- --
- 0.0032
- 3.2
- --
- --
- --
- --
- --
- SF305R
- Halogen-free flame-resistant type polyimide film based stiffener
- --
- --
- 0.0139
- 3.27
- --
- --
- --
- --
- --
- BIF203
- Halogen-free PET insulation bonding sheet
- --
- --
- 0.02
- 3.20
- --
- --
- --
- --
- --
- SDI06K
- Low Dk, Low loss, halogen free, high Tg，FR-4.1
- --
- --
- --
- --
- --
- --
- 1.4%
- 220
- 420
- SDI03K
- Low Dk, halogen free, high Tg，FR-4.1
- --
- --
- --
- --
- --
- --
- 2.1%
- 165(TMA)
- 390
- ST110G
- Halogen Free, High Thermal Conductivity CCL
- --
- 1.0
- --
- --
- --
- --
- --
- --
- --
- SI13U
- Low CTE Material for PKG Substrate
- --
- --
- --
- --
- --
- --
- 13
- 245
- >400
- SI10US
- Advanced Higher Modulus Material for PKG Substrate
- --
- --
- --
- --
- --
- --
- 10
- 280
- >400
- SF280
- Used for sub-6G flexible copper clad laminate
- --
- --
- 0.0032
- 2.92
- 5G Antenna Module
- --
- --
- --
- --
- --
- SF335C
- Polyimide film based coverlay
- --
- --
- 0.019
- 3.27
- Power battery protection board CCM Module Battery Module Antenna Module LCD Module Light-Bar Module Medical Instrument TP Module Vehicle-mounted Module
- --
- --
- --
- --
- --